Happy New Year everyone. We are all looking forward to a prosperous and successful 2020. We have a lot of new ideas on the drawing board for the upcoming year. Some of which are detailed in this newsletter. And, we are working on ways to further engage our members and entice them to become even more involved in IEEE activities. Stay tuned – it will be an exciting year

Recently, I had the opportunity to present a seminar on Blockchain in telecommunications – “Blockchain Integrity, Security, and Reliability for Cable Use Cases.” Sponsored by the Denver IEEE COMSOC chapter, It was a great success and shows us just how quickly  Blockchain continues to find new use cases.

Rather than spending a lot of time covering what is in the presentation, if you are interested, here is the link to Blockchain in Telecommunications slide deck and the video of the presentation. 

There is also a mini-conference on Blockchain – IEEE Blockchain Initiative Denver Local Group Blockchain Transactive Energy. The  Summit, coordinated by The IEEE Blockchain Initiative, the IEEE Denver Blockchain Local Group, Colorado University, and several others.focuses on Blockchain and transactive energy technologies. 

This 2-day event will feature It will feature keynotes, tutorials, peer-reviewed technical paper presentations, posters, demos, and exhibitions from world-leading service providers, solution vendors, research institutes, open-source projects, and academia. The Summit is a forum for the technical exchange of the latest research and innovation, regulation, policies, standards, and applications in the exciting and emerging area of Blockchain for transactive energy. This min-conference is free to attend and open to the public, though we ask you to attend if you register so we have an accurate count and don’t have to turn away anyone who wants to be there.

Blockchain is one of the areas we are looking to bring more visibility to. If any of our members would like to know more about Blockchain, please feel free to contact me.

Finally, I would like to encourage our members to explore the opportunities available to be a part of the IEEE Denver section. We have lots of ways and positions awaiting talented members. Volunteering in the IEEE is both rewarding and a great way to meet new people, as well as open new doors.

Looking forward to a great 2020

Jason

From the Editor

China’s tech ban will likely have long-term consequences for the U.S. tech sector

Following our lead, China has issued an order that all foreign-made hardware and software, for both computers and wireless, be removed from government offices and public institutions within the next three years. That amounts to upwards of 30 million pieces of hardware to change out.

Well, I guess we are now in a full-blown tech war. It really does not seem to matter to our illustrious leaders, since they a) do not have much of a clue about tech, and b) do not seem to care about the fallout for those that rely on Chinese markets.

In all the saber-rattling that has come from Washington, there has not been any proof of actual or particular spyware. Over and over the White House battle cry is “they are a security risk.” Not one shred of evidence have I seen that Huawei hardware is a diabolical security risk. I guess we lowly citizens are just supposed to believe what our illustrious leader says and that is that! So, our economy continues to slow because we cannot sell to China. Our costs go up because there are tariffs on what we import.

China’s ban has already hit some segments hard. Even some out of the tech sector, like soybeans, are taking a hit from the tariffs. Another is the semi industry, which was already in a slump and the bans and tariffs promise to keep them there. And, it is unlikely that the lost sales here will be made up of products built and distributed here (nearly all of these semi companies have some, or all, of their fabs in China).

Within the computer segment, companies such as Dell, HP, and Microsoft will see a decline in sales, as well as have to replace complex and advanced AI components in their hardware. China is ahead of the U.S. in much of the advanced AI – I know, I was there recently and saw what they have first hand.

The results of this are starting to show up little by little. Some economists, the latest being Harvard University professor, and former treasury secretary Larry Summers are warning of a recession in the next year or so, fueled by this trade war. Summers places the odds of a recession before 2021 at nearly 50 percent.

What is so unfortunate is that this latest retaliation is directly due to this President’s hatred of China. Any number of more rational approaches could have been taken by a less obsessive president that realizes the complexities of international relationships.

One of the interesting tangential ramifications is that it illustrates how important and integral, to everyone’s life, technology has become. It is now a political bargaining tool. That brings into focus just where this is headed.

Is this just another round of salvos in the ongoing tit-for-tat trade war? Or will this ban on Western hardware lead to a serious tech cold war – one that might not be resolved quickly, or, possibly, ever.

This is something that both governments need to seriously consider. If the political landscape changes next year, this may all be moot. However, if it does not, the long-term ramifications will alter the global balance of economic power – perhaps permanently. If this does stay the course for the next Presidential cycle, it might take a decade before the path gets altered. Fortunately, China is taking a reserved start to this (waiting for the 2020 election result). Perhaps they are hoping that Trump loses his bid for re-election or leaves office prior to November.

On the flip side, the negative aspects of all of this are not solely limited to America. When it comes to software, for example, China’s industry trails the United States. In a protracted tech ware, China will have to develop its own operating systems and applications, which they have been getting from American firms, and develop related services to support them. However, most analysts agree that China can marshal a lot of resources if they need to and move very quickly. That has already been proven with their 5G platforms.

One of the more interesting prospects of something like this is that it has the potential of metastasizing, globally. What if a global trend develops where more countries take to blocking technology, apps or services from certain countries. The results would be very interesting and not likely beneficial to the worldwide technological ecosystem. For example, the Internet. If countries ban technology that makes the Internet what it is, the world could end up with a highly fragmented or Balkanized Internet.

There is some “WAG-ing” with this. While such a direction is not likely, the point is that we really do not know who might be doing what as the political environment morphs. Who would have thought we would be in a tug-of-war with China in 2019?

The bottom line – status quo is never a good bet. Leaders are fickle and Trump has shown us that the U.S. is just as capable of having a big baby in office as any other country. This administration, and much of the GOP, has, certainly, reminded us that our government is more concerned about its own interests than those of the people. And, the results may well change the global landscape in ways we thought could never happen.

Ernest Worthman

Science, Engineering, and Technology Congressional Visits Day

The Science, Engineering, and Technology Congressional Visits Day (SET CVD) is an annual two-day event that brings engineers, scientists, mathematicians, researchers, educators, and technology executives to Washington to raise visibility and support for science, engineering, and technology. Uniquely multi-sector and multi-disciplinary, the SET CVD is coordinated by a coalition of professional societies, companies and educational institutions. It is open to all who support science and technology, especially federal support for STEM research. The program consists of a series of briefings and meetings, culminating with a full day of visits with your Congressional delegates. Link here: SET Congressional Visits Day

If interested, contact: Russ Harrison, Director, IEEE-USA Government Relations
+1 202-530-8326, r.t.harrison@ieee.org or

Bernadette Concepcion, Administrative Assistant, Government Activities, +1 202-530-8365, b.concepcion@ieee.org

Call for Papers

TPEC 2020

The 4^th annual IEEE Texas Power and Energy Conference, financially and technically co-sponsored by the IEEE Industry Applications Society (IAS), and technically co-sponsored by the IEEE Power and Energy Society (PES) and the IEEE Power Electronics Society (PELS) will be held at Texas A&M University, College Station, Texas, USA, on February 6-7, 2020. This two-day conference will bring together participants from industry and academia to present and discuss the latest research progress and challenges in the power and energy industry.

TPEC 2020 invites authors to submit high-quality research papers from all areas of electric power and energy engineering, especially with the following focus:

• Power Systems
• Power Electronics
• Machines, Electromechanics and Drives
• Cyber and Physical Security
• Renewable Energy and Smart Grid Technologies
• Energy Market and Demand Response

Papers accepted and orally presented by the author at the conference will be submitted for publication through IEEEXplore

All papers presented at this conference are eligible for review by IEEE Industry Applications Society for possible publication in IEEE Transactions on Industry Applications or IEEE Industry Applications Magazine.

Attendees are also welcome to submit posters to TPEC 2020. Accepted posters only qualify for a poster competition hosted at the conference.

Full six-page paper submissions will open on September 20, 2019 and will be due on November 7, 2019.

Sep. 20, 2019: Submission System Opens

Nov. 7, 2019: Full Paper Submission Deadline

Nov. 7, 2019: Poster Abstract Submission Deadline

Dec. 12, 2019: Decisions Notification

Jan. 9, 2020: Final Paper Submission

Jan. 9, 2020 : Final Poster Submission

General information:

Conference website: tpec.engr.tamu.edu

Date: February 6-7, 2020

Location: Memorial Student Center, Texas A&M University, College Station, Texas

Organizer: IEEE PES/IAS/PELS Joint Student Chapter

Email: tpec2020@exchange.tamu.edu

New Systems Applications and Interactive Demonstration Initiative for the 2020 IEEE RFIC Symposium

NEW for RFIC 2020: The RFIC symposium is expanding its scope to include Systems, Applications, and Interactive Demonstrations. This includes systems and applications in 5G, radar, imaging, terahertz, biomedical, connectivity, and optoelectronic areas. In addition to the Emerging Circuit Technology area introduced in RFIC 2019, this year the symposium has introduced a new System Applications sub-committee that targets papers with system novelty in a range of topics related to communication, radar, imaging, security, and biomedical areas. The Interactive Demonstration Session is being restructured to highlight these system papers and provide more engagement opportunities for the audience. Please refer to the Call for Papers and the new FAQ document for system papers for more details.

We invite authors to submit their technical papers via the RFIC 2020 website, Author’s guidelines and Call for Papers can be found here. Complete information on how and when to submit a paper will be posted on the RFIC 2020 website. The symposium solicits papers describing original work in RFIC circuits, systems engineering, design methodology, RFIC technologies, device technologies, fabrication, testing, reliability, packaging, and modules to support RF applications in areas such as Wireless Cellular and Connectivity, Low Power Transceivers, Receiver Sub-Systems, and Circuits, Mixed-Signal RF and Data Converters, Reconfigurable and Tunable Front-Ends, Transmitter Sub-Systems and Power Amplifiers, Oscillators, Frequency Synthesis, Millimeter- and Sub-Millimeter Wave Systems, and High-Speed Data Transceivers.

As in last year, a double-blind review process will be adopted to ensure anonymity for both authors and reviewers. Detailed instructions on how to submit a paper compliant with double-blind rules is posted on the RFIC 2020 website.

Electronic Submission Deadlines:
Technical Paper Summaries in PDF format:                                 10 January 2020
Final Manuscripts for the Digest and Attendee Download:               23 March 2020

All submissions must be made at rfic-ieee.org in pdf form. Hard Copies are not accepted.

DOWNLOAD the RFIC 2020 Call for Papers

Waleed Khalil
RFIC 2020 General Chair

The 2020 IEEE Radio Frequency Integrated Circuits Symposium (RFIC 2020) will be held in Los Angeles, CA, on 21-23 June 2020.

The IEEE International Microwave Biomedical Conference
Sponsored by IEEE MTT-S (Microwave Theory and Techniques Society), AP-S (Antenna and Propagation Society) and EMB-S (Engineering in Medicine and Biology Society) this conference will be held on May 25-28, 2020 in the Hotel Mercure Compans Cafarelli, Toulouse, France.

IMbioC 2020 focuses on presenting and advancing high-quality research on state-of-the-art in microwave and RF theory and techniques that bridge the science and engineering gap as applied to biological systems. During the conference, some workshops and special sessions including Young Professionals (YP) and Women in Microwave (WiM) events will be organized, while an exhibition will be held simultaneously.

We invite abstracts for platform presentations and poster sessions in the following non-exclusive tracks:

Biological and medical applications of microwave and RF systems
Microwave imaging, Magnetic Resonance Imaging (MRI)
Radiometry, thermography, cellular and molecular spectroscopy
Interaction of electromagnetic fields with biological materials and modeling
Pathological, physiological and biochemical studies with EM waves
Computational methods and models for bio-electromagnetics
Electromagnetic safety studies and regulatory compliance
Antennas and sensors for wireless implants
Implantable and wearable diagnostic and therapeutic systems
RF and microwave integrated circuits for biomedical applications
Radar for remote or noninvasive monitoring and tracking
Wireless communication and wireless power transfer for BAN
Biomedical sensors, devices, and instrumentation utilizing EM waves
Internet of Thing (IoT) for biomedical applications
Other related topics

Paper submission:
Authors are invited to submit 3-page manuscripts in PDF format. All papers must be written in English and clearly describe the concept and results. The template is available at https://imbioc-ieee.org/. Papers submitted will be peer-reviewed. The conference proceedings will be submitted to the IEEE Xplore® digital library.

Best Student Paper contest:
Best Student Paper awards will be presented to the winners at the conference. The awards committee will judge the papers on originality, significance, technical soundness, and presentation. To qualify for the award, the author must be a full-time student who presents the paper as the first author.

Important dates:
Paper submission: 01/13/ 2020
Paper notification: 02/17/2020
Final manuscript due: 03/ 09/2020

Special Issue in IEEE J-ERM:
Authors presenting at IMBioC 2020 are invited to submit an expanded version of their papers to a special issue in the IEEE Journal of Electromagnetics, RF and Microwaves in Medicine and Biology (J-ERM): https://ieee-jerm.org.

Contact email: ducrocq@laas.fr

VTC2020-Spring Call for Recent Results Now Open

As an adjunct to the VTC2020-Spring conference, the Technical Program Committee is opening a Recent Results track that will offer the opportunity for rapid publication of emerging work by industry and academia. Authors have the option of seeking an oral or poster presentation accompanied by a paper in the proceedings, or a demo accompanied by a short paper.

The Recent Results track will accept submissions in all topics relevant to VTC. It differs from other tracks in that submission of 2-page abstracts (with results) will be considered as well as 5-page full papers. All abstracts submitted to the Recent Results track will undergo peer-review by subject matter experts, and the full paper version of accepted submissions will be published in the conference proceedings and on IEEE Xplore (conditional on presentation by one of the authors at the conference). All submissions should emphasize the novelty of the work and the results obtained.

Deadlines
Submission of full papers: 20 January 2020
Acceptance notification: 7 February 2020
Final paper submission: 1 March 2020

Paper Submission Site
–Submission of abstracts and full papers should be made through TrackChair at the following URL: vtc2020s-rr-wks.trackchair.com/

CFP: 2020 IEEE International Conference on Microwaves for Intelligent Mobility (ICMIM) Call for Papers

The 6^th annual IEEE International Conference on Microwaves for Intelligent Mobility will be held on April 20-21, 2020 in Linz, Austria. The conference covers all key enabling technologies for intelligent mobility, including components, circuits, and systems, from decimeter to millimeter waves. Potential applications include automated land, sea, and airborne vehicles, robotics, automotive radar, intelligent transport systems, and other industrial applications, navigation and localization, mobile communications (Car-to-X, 5G), driver assistance, and over-the-air testing.

ICMIM2020 is co-sponsored by IEEE Microwave Theory and Techniques Society and Johannes Kepler University Linz, Austria and technically co-sponsored by the IEEE Antennas and Propagation Society, the European Microwave Association (EuMA), the Austrian Joint COM/MTT and CAS/SCC chapters, the Linz Center of Mechatronics (LCM) and the Silicon Austria Labs (SAL).

Authors are invited to submit their contributions for review electronically. We accept papers of 3-4 pages in pdf format.

All submissions must be received by 07 January, 2020.
Accepted papers will be published in IEEE Xplore.

For further information please see the attached
Call for Papers and visit the conference web site:
https://www.icmim-ieee.org

The final conference program will include invited keynotes from leading experts from across the globe, as well as regular oral presentations, and interactive poster contributions. The conferences is accompanied by a table-top exhibition presenting the latest radar and communication technology during the conference.

Best regards,
Andreas Stelzer, General Chair
Reinhard Feger, Technical Program Co-Chair
Christoph Mecklenbruker, Technical Program Co-Chair

IEEE Women in Engineering

St. Mary’s Academy strong in STEM support

In 2013, Morgan Wagner and Dave Gesler took a risk and founded the St. Mary’s Academy Robotics All-Girls Team, 5493 (“SMAbotics_AG”), in Englewood Colorado. They did it with the intent of creating a place where young women could develop their confidence and pursue their passions in STEM. SMAbotics_AG works tirelessly to implement our mission statement: “We strive to ignite young women’s passion for STEM through Leadership, Collaboration & Creativity. Together, we can be the next generation of innovators in our increasingly globalized, technologically-driven world.” Every day, we make an effort to build an environment where young women are excited to take on a challenge in STEM and know they will be successful with persistence and hard work. In each girl, we hope to instill the confidence and will to take risks, fail, and try again. Furthermore, SMAbotics aims to develop strong, resilient, and dedicated women leaders in STEM. SMAbotics_AG aspires to grow through the years, passing down traditions and empowering the next generations of young women.

For more information, to become a sponsor, or just support a great cause, here are a couple of websites for them.

https://smabotics.com/

https://smabotics.com/our-story/

Build Something Cool (BSC)

Mark your calendars for Saturday February 29, 2020!
Spread the word. We  invite all 6-12th graders to our 6th annual “Build Something Cool” event  at the Downtown Auraria Campus in Denver.

You will be getting more information in the coming weeks about how to get involved.

With your help and participation, we will all have another great success and fun time for all!

BSC 2019 – Google Photo Link: https://photos.app.goo.gl/c4MjdR7ZYN5ihTCh9

Masters Program/Graduate Certificate, Colorado School of Mines

Graduate Certificate, Master of Science, Master of Science (Non-Thesis)

The Future Electric Grid will be Smart

The Future Electric Grid will be smart, with user-interaction, and bidirectional power flow, with deep penetration of renewable energy resources.

Students in Smart-Grid, Power Electronics, and Electrical Power Systems will learn a combined power system and power electronics approach, in which enabled renewable energy systems interact with the utility grid, establishing smart-grids with intelligent data communication, energy management and control.

This Graduate Program approaches electrical power generation, transmission, distribution and user-friendly control. Graduates will advance technology in industries and national laboratories, and will be key leaders for the sustainability of renewable energy based electrical energy conversion.

The Smart-Grid Electrical Power and Energy Systems program supports Mines mission, as a global leader in research and the advancement of technology. The research in this new program will allow a unified power system and power electronics approach, where enabled renewable energy systems will interact with the utility grid, establishing microgrids, with intelligence and data communication, in order to make our future utility grid a Smart-Grid, and our Mines graduates, leaders in this 21st century technology.

• Certificate Program – four core courses
• MS-Non-Thesis – course-work in accordance to the Graduate Catalog.
• Master’s Program – Core courses, plus courses indicated in the Graduate Catalog, research.
  • Students must take 30 credits; course rotation is taught with frequency of 2 to 2.5 years.
  • Master’s Committee – Committee formed by three Faculty in this Program will advise student’s research.

Contact – Prof. Marcelo Godoy Simoes, e-mail: msimoes@mines.du

IEEE Happenings

IEEE 6th World Forum on Internet of Things (WF-IoT 2020)

5-9 April 2020 // New Orleans, Louisiana, USA: https://wfiot2020.iot.ieee.org/

The 2020 IEEE 6th World Forum on the Internet of Things (WF-IoT 2020) is the premier conference of the IEEE IoT Initiative. Every year the conference is attended by hundreds of most active participants from research community, government and public sector, small business, multinational corporations and industry. The technical papers, presentations and events at this conference are focused on contributions to enhance and accelerate the adoption of the IoT technologies and applications for the benefit of humanity. WF-IoT 2020 will include a multi-dimensional program of technical research papers, expert presentations, panels, workshops, tutorials and industry forums on the latest technology developments and innovations in many fields and disciplines that drive the utility and vitality of the IoT solutions and applications.

3rd IoT Vertical and Topical Summit

The Internet of Things (IoT) and the mmWave Frontier

The 3rd IoT Vertical and Topical Summit will be held January 26 -27, 2020 as part of RWW2020 in San Antonio, Texas. The one and a half day Summit will address the important role that mmWaves play in the IoT ecosystem.  The choice of the theme, “IoT and the mmWave Frontier”, is motivated by increases in deployment and the regulatory attention paid to new allocations of licensed and unlicensed mmWave spectrum.

The Summit is designed to foster dialogue amongst professionals from industry, the public sector, and the research community. Participants will gather in a highly interactive setting to explore mmWave solutions— from 30GHz to 300GHz as well as the adjacent spectrum from 6GHz to 30GHz and 300GHz to 1,000GHz— and applications for IoT, with a focus on the opportunities and challenges for adoption. This includes electromagnetic-waves used as a technology for: (i) Communications; (ii) Sensors; and (iii) Manufacturing/Industrial Processes.

RWW Website: https://radiowirelessweek.org/

IEEE Future Networks

2020 IEEE 3rd 5G World Forum Call for Papers and Proposals
The 2020 IEEE 3rd 5G World Forum (5GWF’20) in Bangalore, India, seeks contributions on how to nurture and cultivate 5G technologies and applications for the benefit of society. 5G systems should unveil a novel mobile network architecture that not only improves physical data rate, but also creates a new ecosystem allowing the deployment of novel services and applications. A key target is to build a novel network architecture that should support not only classical mobile broadband applications and services but also vertical industry (e.g. Intelligent Transport, Industrial IoT, eHealth, etc.) and other 5G-based services. Learn more at the conference website.

IEEE Future Networks Tech Focus September Issue now available

The IEEE Future Networks Tech Focus is a content-driven online publication containing practical and timely technical information and forward-looking commentary on developments and deployments of current and future generations of networks around the world. The September issue of IEEE Future Networks Tech Focus eNewsletter includes:

• Advanced 5G Validation Trials across Multiple Vertical Industries
• 5G Communications Systems and Radiofrequency Exposure Limit
• Key New Fiber Wireless Access Technologies for 5G and Beyond
• Ultra-high Capacity Wireless Communication by Means of Infrared Optical Beams

Read past articles and learn how to submit an article

IEEE Future Networks Podcasts with the Experts

In the latest episode of IEEE Future Networks Podcasts with the Experts, titled “5G Connectivity Beyond the City – Agricultural Use Cases through 5G Rural First,” James Irvine talks with Karina Maksimiuk and Greig Paul about their work with 5G Rural First, a UK government test bed and trial project, which describes itself as a “call to action” to be sure the benefits of 5G go beyond the city. Podcasts are available on iTunes, Google Podcasts, or on the Future Networks portal

Call for Participation: IEEE International Network Generation Roadmap (INGR)

The Future Networks Initiative is looking for volunteers to contribute to the IEEE International Network Generation Roadmap whose objective is to guide and focus the industry and standards ecosystems to successfully evolve network generations (5G and beyond) from current to future state, including

• Technology and business drivers and trends
• Technology assessments and future needs
• Key topic areas, enabling technologies, and capabilities
• Challenges and gaps for achieving needs
• Possible solutions and innovations

We have a variety of working groups that are looking for participants, such as Edge Automation Platform, Optics, Millimeter Wave, Satellite, and more. Learn more and consider volunteering. Contact information can be found here.

In addition, an Industry Advisory Board meets regularly to ensure that industry needs, challenges, and expectations are addressed. Email 5Groadmapinfo@ieee.org if you are interested in participating on the INGR Industry Advisory Board.

For more information contact:

Ashutosh Dutta, Co-Chair IEEE Future Networks Initiative

Tim Lee, Co-Chair IEEE Future Networks Initiative

Gerhard Fettweis, Co-Chair IEEE Future Networks Initiative

IEEE Future Directions

IEEE Blockchain

Blockchain – More than Cryptocurrency, blockchain is a technological foundation to a new way of conducting transactions, securing networks, and recording the validity and origin of data. Blockchain will allow a new perspective on how humans interact to society’s challenges; touching upon everything from financial transactions, energy trading, carbon emission trading, protection and easy access to healthcare records, to the protection of the valued assets of corporations and nation states.

IEEE Brain           

Brain – This initiative is dedicated to advancing technologies that improve the understanding of brain function, revolutionizing current abilities to reverse engineer neural circuits in both the central and peripheral nervous systems, and developing new approaches to interface the brain with machines for augmenting human-machine interaction and mitigating effects of neurological disease and injury.

IEEE Digital Reality          

Digital Reality – This initiative serves to enable the coming Digital Transformation through collaboration among technologists, engineers, regulators, and ethicists. The Digital Transformation is fueled by advances in sensors and actuators, artificial intelligence (AI), and machine learning (ML). By leveraging these technologies and others, such as augmented reality (AR), virtual reality (VR), and Digital Twins, the line between the physical world and the digital world will be increasingly less distinct.

GreenTech 2021 & R5 Annual Meeting

by Ian MacMillan

Denver Section will be again hosting the GreenTech & R5 Annual Meeting in 2021.  The Students Robotics Competition is an exciting part of the the R5 Annual Meeting. The Conference Organizing Committee is forming up if you’d like to be involved in making this great fun conference happen, please contact conferences@ieee-denver.org.

2020 IEEE Green Tech Conference:

1-3 April, 2020; Oklahoma City OK

The IEEE Oklahoma City Section wants to hear from you with the possibility to present your Green Technology ideas so you can be an individual, academician or businessperson to write a paper? We’re looking for papers along the following ‘tracts’ or you can look at https://ieeegreentech.org/cfp/ for full details and sub-genres of each ‘track’:

Energy Generation & Storage Technologies
Energy Usage Reduction and Conservation
Architectural and Engineering Sustainable Designs
Environmental, Legal, Social, Economic, and Political Impacts
Smart Systems and Smart Infrastructures
Sustainable IT, Computing & Software Engineering
Biomedical & Biotechnology
Radar, Weather Forecasting, Water & Sanitation
If we pick your abstract for selection in the 2020 IEEE GreenTech Conference there are a number of ways you can choose to present as a patron, including:

Individual presentations, Tutorials or Workshops
Seminar/Special Sessions
Executive Forum/Panel Session
Demonstrations or Presentation Session

The best papers shall be included in the conference proceeding then will be submitted to the IEEE Xplore® digital library

Deadlines and (Notification Dates):
Workshop Proposal: Oct 7, 2019
Technical Paper: Oct. 7, 2019 (Nov. 4, 2019)
Tutorial, Forum, Panel & Talk: Oct. 14, 2019 (Oct 21, 2019)
Graduate & Doctoral Poster: Nov. 18, 2019 (Dec 02, 2019)
Technical Camera Ready: Nov. 25, 2019
Student Poster, Showcase and Recruiter: Dec. 9, 2019 (Dec 23, 2019)

Please contact any of the names below if you have any question.
Technical Program Chair: Pierre Tiako, PhD (tiako@ieee.org)
Industrial Program Chair: Ryan Musgrove (ryan.musgrove@ieee.org)
General Conference Chair: Robert Scolli (r.scolli@ieee.org)

Robert Scolli
2019 IEEE OKC Section Chair ieeeOKC.org
2019-2020 General Chair
2020 IEEEGreenTech.org