Events for October 8, 2026

The 16th IEEE Global Humanitarian Technology Conference (GHTC 2026) is a flagship global conference sharing practical technology-enabled solutions supporting achievement of the United Nations Sustainable Development Goals (UN SDGs) by addressing the needs of underserved communities in resource-constrained environments around the world. GHTC 2026 will be hosted at University of Colorado, Boulder Mortensen Center in Global Engineering and Resilience of October 7 - 10. Registration is open. See the GHTC 2026 (https://ieeeghtc.org/2026-registration/) for details on fees and options. GHTC 2026 will include four keynote speakers: [] GHTC is focused on bringing together people working on the application of technology to addressing critical issues for the benefit of the resource-constrained and vulnerable populations in the world. It is a forum where (http://www.ieee.org/index.html) works with developers and NGOs to identify the most pressing needs. We encourage participants from academia, for-profit and non-profit businesses, governmental and non-governmental organizations to attend and present research, ideas, and other considerations for the creation of effective humanitarian technology. We also invite participants to share case studies and lessons learned from deployment and application of humanitarian technologies. Why Attend? - Participate in an extensive, vibrant, and innovative technical program - Learn from world-class knowledgeable practitioners working in the field - Exchange information, share experiences and network with attendees actively involved in the fields - Gain visibility and recognition for your humanitarian work, projects and ideas - Find new resources and potential partners or investors See the GHTC 2026 (https://ieeeghtc.org/2026-program/) schedule and details. - View descriptions of (https://ieeeghtc.org/keynotes-special-sessions/). - View full schedule of (https://ieeeghtc.org/technical-paper-presentations-schedule-2026/). Co-sponsored by: University of Colorado, Boulder Agenda: See the GHTC 2026 (https://ieeeghtc.org/2026-program/) schedule and details. Bldg: SEEC Building, , 4001 Discovery Drive, Boulder, Colorado, United States, 80303

We’re hosting a special member gathering on Thursday, October 8, giving our Section members a unique opportunity to meet two of IEEE Region 5’s leaders and learn more about the future of IEEE in our region. Chris Sanderson, IEEE Region 5 Director, and Ian MacMillan, Director-Elect, are eager to meet our members, hear what you think, and learn more about what matters to you. This will be an informal, open discussion—not a presentation. Bring your questions, ideas, concerns, or simply your curiosity about where IEEE is headed and how our Region can better serve its sections. Come meet the people who help shape IEEE Region 5—and let them hear directly from you. And please feel free to bring your spouse or partner. We want this to be an enjoyable evening and an opportunity to connect with fellow IEEE members. Attendance will be limited to 40 people, so please sign up early! We hope you’ll join us for this special opportunity to meet, talk, and help shape the future of IEEE. A light snack will be served Speaker(s): Chris, Ian, Faye Agenda: 5:00 pm Doors Open 5:30 pm Introductions 5:45 pm Comments by Directors 6:15-7:30 pm Q & A Room: 300, Bldg: Lory Student Center, 1101 Center Ave Mall, Colorado State University, Fort Collins, Colorado, United States, 80521

Abstract: As semiconductor manufacturing pushes against the limits of traditional monolithic chip design, chiplet-based architectures have emerged as a transformative solution for the industry. By breaking complex processors into smaller, discrete dies, manufacturers can significantly improve yields, reduce waste, and circumvent the hard reticle-size limitations imposed by modern lithography machines. This approach also unlocks powerful cost and efficiency advantages, allowing engineers to optimize each functional block by selecting the most appropriate manufacturing node, for example, pairing cutting-edge processes for high-performance logic with more cost-effective nodes for memory and I/O components. Chiplet architectures, however, have brought renewed focus to the packaging that sits between the silicon die and the system PCB. These packages have had to increase in complexity to support many more chiplet-to-chiplet connections. Today’s advanced packages make it possible to combine specialized CPU, AI, and graphics modules within a single package. The ability to reuse proven chiplet designs and selectively upgrade individual functional blocks without redesigning an entire system represents a shift in how the semiconductor industry approaches processor development. This talk will explore how chiplet technology is overcoming the manufacturing, economic, and design challenges facing the industry and shaping the future of advanced semiconductor packaging. Parking: Parking information at CU Boulder will be provided to event registrants closer to the event date. ** The Front Range Speaker Series brings together students, faculty, IEEE members, and engineering professionals for technical talks from experts across industry and academia. This event is part of the ongoing speaker series co-hosted by the IEEE University of Colorado Boulder Student Branch and the IEEE Denver Section. This series is open to all levels from technical beginners to experts. Upcoming Talks: - Thursday, November 5, 2026:"Package and PCB Materials" by Darren Hitchcock (Panasonic) - Thursday, December 3, 2026: Student presentations showcasing research and industry topics Agenda: Example Agenda - 6:45–7:00 PM — Arrival and attendee check-in - 7:00–7:10 PM — Welcome and speaker introduction - 7:10–8:10 PM — Speaker presentation - 8:10–8:20 PM — Q&A and discussion - 8:20–8:30 PM — Closing remarks and upcoming speaker-series announcements Room: ECCR 200, Bldg: Engineering Center, 1111 Engineering Drive, Boulder, Colorado, United States, 80309