Abstract- The massive data deluge from mobile, IoT, and edge devices, together with powerful innovations in data science and hardware processing, have established artificial intelligence (AI) as the cornerstone of modern medical, automotive, industrial automation, and consumer electronics domains. Domain-specific AI accelerators now dominate CPUs and GPUs for energy-efficient AI and machine learning processing. However, the evolution of these electronic accelerators is facing fundamental limits due to the slowdown of Moore’s law and the reliance on metal wires, which severely bottleneck computational performance today. In this talk, I will present my vision of how silicon photonics can drive an entirely new class of light-driven AI hardware accelerators that can provide orders of magnitude energy improvements over today’s accelerators. I will discuss the evolution of silicon photonics, from integrated optics to photonic devices that can now be fabricated with low-cost CMOS-compatible manufacturing techniques. I will cover new directions in the design of robust and secure photonic substrates for communication, computation, and storage to support emerging AI applications based on LLMs, graph processing, and generative modeling. I will share experiences from my journey over the past two decades towards realizing viable silicon photonic architectures. I will end the talk with a discussion of the open challenges to achieve unparalleled energy-efficiency and performance gains in future computing platforms with silicon photonics. Sudeep Pasricha Sudeep Pasricha is a Aram and Helga Budak Endowed Professor in the (http://www.engr.colostate.edu/ece/)the (http://www.cs.colostate.edu/), and the (https://www.engr.colostate.edu/se/) at (http://www.colostate.edu/). He is currently Director of the Embedded, High Performance, and Intelligent Computing ((https://www.engr.colostate.edu/~sudeep/wp-content/uploads/epic_lab_poster.pdf)) Laboratory and the Chair of Computer Engineering. He is a former University Distinguished Monfort Professor and College of Engineering Rockwell-Anderson Endowed Professor. --------------------------------------------------------------- Coming up In May- Speaker(s): Sudeep, Agenda: 6:00 pm Doors Open 6:30 pm Welcome-Kris Waage 6:45 pm Did'ja Hear? Scott Evans 7:00 pm Main Presentation 8:30 pm End TBA, Fort Collins, Colorado, United States, 80525, Virtual: https://events.vtools.ieee.org/m/474065

Speaker(s): Eli Cox Agenda: 6:25to 6:35 PM - Open for participants to enter and network. 6:35 to 6:40 PM - IEEE LM and CTCN Business meeting and to introduce speaker. 6:40 to 7:55PM - Formal Program and Q&A. Room: 8, Bldg: Asian American Resource Center, 8401 Cameron Rd., Austin, Texas, United States, 78754, Virtual: https://events.vtools.ieee.org/m/477911

Come join us for this Dine and Learn event hosted by the Denver Section and University of Colorado Boulder. You're invited to participate in an exciting and engaging presentation titled "From Wafers to Cutting-Edge Products: The process of Testing, Packaging, and Design" by Tim Swettlen. Whether you're a college student eager to expand your knowledge or a technical professional looking to stay informed in this evolving industry, this presentation aims to cover the key test and assembly stages that deliver functional products to market. * Food and beverage will be provided. * Parking code will be provided to event registrants. Abstract: As Moore’s Law slows down on transistor density at the die level, advanced packaging methods are bridging the gap and continue to deliver ever more powerful products. To understand these changes, a thorough understanding of the testing flow is important as more die are stacked on a single final product. This talk starts as the wafer exits the fab, is exposed to a battery of tests and routed to its highest value package and product. Each die on the wafer is processed on the same test flow but its testing results will direct it to different bins sold at different selling prices. These complex test flows allow the right parts to be assembled into the best final product whether it’s an advanced smart phone or an entry level AI accelerator card. Co-sponsored by: University of Colorado Boulder Speaker(s): Tim Swettlen, Agenda: Agenda: 6:00- 6:30PM Food and networking 6:30-7:30 PM Presentation 7:30- 8:00 PM Q&A Discussion 8:00 PM Adjourn Room: 1B70, Bldg: Discovery Learning Center (DLC), University of Colorado Boulder, 1095 Regent Drive, Boulder, Colorado, United States, 80309, Virtual: https://events.vtools.ieee.org/m/476572