Sarah LaSelva, Chief Product Marketing Manager of NI will give a talk on the current state of 6G communication technology, the roadmap and challenge as well as her team's work in this area in NI, a subsidiary of Emerson Electric Co. Co-sponsored by: IEEE CTS Consultants Network Speaker(s): Sarah LaSelva Agenda: 6:30 to 6:35 PM - Open for participants to enter and network. 6:35 to 6:45 PM - IEEE LM and CTCN Business meeting and speaker introduction. 6:45 to 7:45 PM - Formal Program and Q&A. Virtual: https://events.vtools.ieee.org/m/474476

The Innate Magnetic Fields of Lithium-Ion Batteries Joshua R. Biller April 9th, 2025 Abstract: Lithium-ion batteries (LiB) are ubiquitous and drive a wide variety of devices from personal electronics to electric vehicles. Development of LiB has traditionally been driven by electrochemists and has focused heavily on optimizing charge density per cell. An unintentional end result is a handful of predominant cathode chemistries – LiFePO4 (LFP), LiCoO2 (LCO), LiNiAlCoO2 (NCA), or LiMn2O4 (LMO) – many of which can also be considered as dilute magnetic semiconductors. The magnetic nature of separate LiB components (i.e. anode, cathode, electrolyte, etc.) has been most studied using SQUID magnetometry. Nuclear magnetic resonance (NMR) and electron paramagnetic resonance (EPR) are increasingly used as well. Within the last six years, in vitro magnetometry has shown an innate magnetic field persists for LiB. Initial work centered on special non-magnetic pouch cell geometries. Recently we’ve shown that this magnetic field persists even for larger cylindrical formats like the 18650 and 21700. In addition, changes in the innate magnetic field of LiB can be correlated with changes in the state of health of the battery. A question immediately arises – “How is this signal here to measure?”. In this talk, two different answers to that question will be discussed. The first answer is technical in nature and revolves around a wide variety of magnetometer types (OPM, AMR, TMR) which have been used to capture the magnetic field signal, and the nature of the anisotropic magnetic field emanating from a LiB cell. The second answer is less well developed, and revolves around how ferromagnetic, ferrimagnetic, and super-exchange interactions may possibly combine from the atomic to device scale to present the measured innate magnetic field. Much is unknown - but the importance of LiB in everyday life drives the need for increased understanding of magnetics to augment the existing knowledge of electrochemistry in the rational application, re-use and recycling of LiB. Co-sponsored by: NIST Magnetic Imaging Group Speaker(s): , Josh Agenda: Talk: 11:00AM to 12:pm IEEE Lunch Taj 12:15pm to 1:15pm Room: 1A116, Bldg: 81, 325 Broadway, Boulder, Colorado, United States, 80305, Virtual: https://events.vtools.ieee.org/m/477103

Abstract- The massive data deluge from mobile, IoT, and edge devices, together with powerful innovations in data science and hardware processing, have established artificial intelligence (AI) as the cornerstone of modern medical, automotive, industrial automation, and consumer electronics domains. Domain-specific AI accelerators now dominate CPUs and GPUs for energy-efficient AI and machine learning processing. However, the evolution of these electronic accelerators is facing fundamental limits due to the slowdown of Moore’s law and the reliance on metal wires, which severely bottleneck computational performance today. In this talk, I will present my vision of how silicon photonics can drive an entirely new class of light-driven AI hardware accelerators that can provide orders of magnitude energy improvements over today’s accelerators. I will discuss the evolution of silicon photonics, from integrated optics to photonic devices that can now be fabricated with low-cost CMOS-compatible manufacturing techniques. I will cover new directions in the design of robust and secure photonic substrates for communication, computation, and storage to support emerging AI applications based on LLMs, graph processing, and generative modeling. I will share experiences from my journey over the past two decades towards realizing viable silicon photonic architectures. I will end the talk with a discussion of the open challenges to achieve unparalleled energy-efficiency and performance gains in future computing platforms with silicon photonics. Sudeep Pasricha Sudeep Pasricha is a Aram and Helga Budak Endowed Professor in the (http://www.engr.colostate.edu/ece/)the (http://www.cs.colostate.edu/), and the (https://www.engr.colostate.edu/se/) at (http://www.colostate.edu/). He is currently Director of the Embedded, High Performance, and Intelligent Computing ((https://www.engr.colostate.edu/~sudeep/wp-content/uploads/epic_lab_poster.pdf)) Laboratory and the Chair of Computer Engineering. He is a former University Distinguished Monfort Professor and College of Engineering Rockwell-Anderson Endowed Professor. --------------------------------------------------------------- Coming up In May- Speaker(s): Sudeep, Agenda: 6:00 pm Doors Open 6:30 pm Welcome-Kris Waage 6:45 pm Did'ja Hear? Scott Evans 7:00 pm Main Presentation 8:30 pm End TBA, Fort Collins, Colorado, United States, 80525, Virtual: https://events.vtools.ieee.org/m/474065

Come join us for this Dine and Learn event hosted by the Denver Section and University of Colorado Boulder. You're invited to participate in an exciting and engaging presentation titled "From Wafers to Cutting-Edge Products: The process of Testing, Packaging, and Design" by Tim Swettlen. Whether you're a college student eager to expand your knowledge or a technical professional looking to stay informed in this evolving industry, this presentation aims to cover the key test and assembly stages that deliver functional products to market. * Food and beverage will be provided. * Parking code will be provided to event registrants. Abstract: As Moore’s Law slows down on transistor density at the die level, advanced packaging methods are bridging the gap and continue to deliver ever more powerful products. To understand these changes, a thorough understanding of the testing flow is important as more die are stacked on a single final product. This talk starts as the wafer exits the fab, is exposed to a battery of tests and routed to its highest value package and product. Each die on the wafer is processed on the same test flow but its testing results will direct it to different bins sold at different selling prices. These complex test flows allow the right parts to be assembled into the best final product whether it’s an advanced smart phone or an entry level AI accelerator card. Co-sponsored by: University of Colorado Boulder Speaker(s): Tim Swettlen, Agenda: Agenda: 6:00- 6:30PM Food and networking 6:30-7:30 PM Presentation 7:30- 8:00 PM Q&A Discussion 8:00 PM Adjourn Room: 1B70, Bldg: Discovery Learning Center (DLC), University of Colorado Boulder, 1095 Regent Drive, Boulder, Colorado, United States, 80309, Virtual: https://events.vtools.ieee.org/m/476572

Meeting for general administration and operation of the Black Hills Subsection. Virtual: https://events.vtools.ieee.org/m/477603